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Thermal Stress and Strain in Microelectronics Packaging
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Author Name:    Lau, John

Title:   Thermal Stress and Strain in Microelectronics Packaging

Binding:   PAPERBACK

Book Condition:   New

Publisher:    Springer 

ISBN Number:   1468477692 / 9781468477696

Seller ID:   ING9781468477696

1468477692 Special order direct from the distributor

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Microelectronics packaging and interconnection have experienced exciting growth stimulated by the re...



Price = 291.59 CDN
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